Grinding apparatus and method which supports a workpiece on the surface being ground
US5595524A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 17, 1995 |
| Grant date | Jan 21, 1997 |
| Priority date | — |
| Expiry date | Feb 17, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B47/206
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for grinding a surface on a workpiece, such as a spigot on a pipe, while supporting the workpiece on the surface being ground. The grinding apparatus includes workpiece support wheels, two of which are positioned beneath the workpiece and contact the workpiece at the surface being ground. The grinding apparatus also includes a rotator mechanism, such as a motor which drives one of the workpiece support wheels in frictional contact with the workpiece outer surface, for rotating the workpiece. The grinding apparatus further includes a surface grinding mechanism, such as a motor and grinding or cutting wheel positioned generally between the two workpiece support wheels and which contacts the surface being ground. The cutter mechanism is adjustable in a vertical direction and angularly to grind an angled surface. According to the method of grinding, the grinding surface of the workpiece is maintained in contact with the two workpiece support wheels so that the workpiece self-feeds towards the surface grinding mechanism. The grinding apparatus can also include an end workpiece support to prevent horizontal movement of the workpiece, a top workpiece support to prev…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.