Wafer of transducer chips
US5596222A · kind A · utility
33Cited by
2References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 12, 1994 |
| Grant date | Jan 21, 1997 |
| Priority date | — |
| Expiry date | Aug 12, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/928
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A wafer and a method of making a wafer containing a plurality of severable transducer chips includes a wafer; a plurality of transducer chips formed on the wafer; and a grid of longitudinal and latitudinal grooves in the wafer for separating the chips from each other and enabling them to be easily, individually severed from the wafer, as well as a transducer chip and a method of making it, having integral raised contacts adapted for a flip chip or beam lead interconnection, with a transducer formed on the chip; and a plurality of raised contacts integrally formed with the chip and electrically interconnected with the transducer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.