Molded-in lead frames
US5596224A · kind A · utility
11Cited by
16References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 1995 |
| Grant date | Jan 21, 1997 |
| Priority date | — |
| Expiry date | May 1, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosure features lead frames, molded lead frames and adapters and sockets produced by molding these lead frames. In general, the lead frames comprise a frame and a circuit, wherein the circuit comprises a plurality of electrical conducting elements. The elements are held in position by the frame, and each element comprises an area within the element suitable for positioning a pin through the element to electrically connect the element with the board. The lead frame can be molded in plastic and trimmed to remove the frame to leave each element electrically separate from each other element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.