Magnetron cathode sputtering method and apparatus
US5597459A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 8, 1995 |
| Grant date | Jan 28, 1997 |
| Priority date | — |
| Expiry date | Feb 8, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3408
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A magnetron sputtering cathode assembly provides an annular target of sputtering material located with a sputtering surface facing a substrate to be sputtered. An inner magnet and an outer ring magnet are positioned adjacent inner and outer edges of the sputtering surface. The outer ring magnet is oriented so that its North-to-South magnetic orientation is substantially parallel to the plane defined by the sputtering surface while the inner magnet is oriented so that its North-to-South magnetic orientation is substantially perpendicular to the plane defined by the sputtering surface. A pair of walls extend at the inner and outer edges of the annular target away from the sputtering surface and toward the substrate. The walls and the magnets define a closed-loop array of radial magnetic lines having improved target erosion and plasma-containing characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.