Solution for coating non-conductors with conductive polymers and their metallization process
US5597471A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 1995 |
| Grant date | Jan 28, 1997 |
| Priority date | — |
| Expiry date | Apr 11, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S205/925
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A process for metallizing non-conductive surfaces, by treating the non-conductive surface with a solution containing at least one suspended or solute oxidation agent, contacting the treated non-conductive surface with an acidic solution containing at least one water soluble polymer selected from the group consisting of homopolymers and copolymers, and at least one aromatic compound which chemically polymerizes the water-soluble polymer and the aromatic compound to form a conductive polymer, and electroplating the conductive polymer. Each water-soluble polymer contains uncharged structural elements or is cationic polyelectrolyte. Additionally, each water soluble polymer is capable of protonizing/deprotonizing reactions, formation of hydrogen bridge compounds and van der Waals interactions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.