Patent · US Expired

Solution for coating non-conductors with conductive polymers and their metallization process

US5597471A · kind A · utility

9Cited by
4References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 11, 1995
Grant dateJan 28, 1997
Priority date
Expiry dateApr 11, 2015

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S205/925
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

A process for metallizing non-conductive surfaces, by treating the non-conductive surface with a solution containing at least one suspended or solute oxidation agent, contacting the treated non-conductive surface with an acidic solution containing at least one water soluble polymer selected from the group consisting of homopolymers and copolymers, and at least one aromatic compound which chemically polymerizes the water-soluble polymer and the aromatic compound to form a conductive polymer, and electroplating the conductive polymer. Each water-soluble polymer contains uncharged structural elements or is cationic polyelectrolyte. Additionally, each water soluble polymer is capable of protonizing/deprotonizing reactions, formation of hydrogen bridge compounds and van der Waals interactions.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.