Resilient electrical interconnect
US5599193A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 23, 1994 |
| Grant date | Feb 4, 1997 |
| Priority date | — |
| Expiry date | Aug 23, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0133
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrical interconnect is provided for connecting an integrated circuit or other electrical or electronic component to a circuit board or for interconnecting two or more circuit boards. The interconnect comprises a substrate having one or more resilient elements of a non-conductive material and having opposite contact surfaces. A flexible conductive coating is provided on the contact surfaces of the resilient elements and extends between the contact surfaces to provide electrical connection therebetween. In one embodiment each element is integrally formed with a resilient substrate and has electrically conductive contact surfaces which are outward of the respective substrate surfaces and are electrically connected through a conductive surface which extends through vias or openings formed in the substrate. In another embodiment, each element is individually formed and is disposed within a corresponding cavity of a separate substrate. In a further embodiment, each element is individually formed having different sections of different durometers so as to provide intended spring or resilience characteristics. A particulate layer can be provided on the conductive contact surfaces to …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.