Torque wire thermal strain relief
US5600067A · kind A · utility
5Cited by
9References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 1995 |
| Grant date | Feb 4, 1997 |
| Priority date | — |
| Expiry date | May 23, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P15/132
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for relieving thermal stress on the flexures of an accelerometer, particularly a quartz accelerometer, caused by the difference in the coefficient of expansion of a bonding adhesive or a sealant placed over a bonding pad to protect or attach the ends of the torque coil and the coefficient of expansion of the quartz. The strain is relieved by supporting the bonding pads on flexible attachments to prevent thermal stress from being transferred into the pendulum and flexures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.