Electrostatic chuck
US5600530A · kind A · utility
40Cited by
63References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 10, 1994 |
| Grant date | Feb 4, 1997 |
| Priority date | — |
| Expiry date | Jun 10, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10303
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electrostatic chucks and methods of forming the chucks are disclosed. The chucks include ceramic materials directly bonded with a layer of active braze alloy. The active alloy operates as both a conductive layer of the electrostatic chuck and a mechanism for bonding the dielectric layer to the base of the chuck. Electrical feedthroughs to the electrode may also be formed using the active alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.