Solder-precipitating composition and mounting method using the composition
US5601228A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Aug 2, 1995 |
| Grant date | Feb 11, 1997 |
| Priority date | — |
| Expiry date | Aug 2, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention provides a solder-precipitating composition containing Sn-Pb alloy powder and an organic acid salt of Pb as essential components, and capable of precipitating solder as a result of substitution between Sn contained in the Sn-Pb alloy powder and Pb contained in the organic acid salt of Pb. Further, the invention provides a mounting method including the steps of supplying a conductor on a board with a solder-precipitating composition which contains Sn-Pb alloy powder and an organic acid salt of Pb as essential components, heating the solder-precipitating composition supplied on the conductor, to precipitate solder on the conductor and pre-coat the conductor with solder, as a result of substitution reaction between Sn in the Sn-Pb alloy powder and Pb ions in the organic acid salt of Pb, mounting a device on the solder pre-coated conductor, and melting the solder layer to securely mount the device on the conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.