Electroless gold plating solution
US5601637A · kind A · utility
2Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 1995 |
| Grant date | Feb 11, 1997 |
| Priority date | — |
| Expiry date | Aug 14, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/44
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides an electroless gold plating solution which offers deposition layers exactly onto predetermined areas on the surface of the workpiece, without undesirable spread of plated areas. The electroless gold plating solution according to the invention contains 5-500 mg/l, or preferably 10-100 mg/l, or sodium nitrobenzenesulfonate and/or p-nitrobenzoic acid as a reduction inhibitor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.