Thick film paste
US5601638A · kind A · utility
30Cited by
8References
11Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 20, 1995 |
| Grant date | Feb 11, 1997 |
| Priority date | — |
| Expiry date | Nov 20, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thick film paste for use in the formation of a conductor, a resistor, an insulator, a protector or the like in a ceramic wiring substrate by a printing process, wherein at least 2-tetradecanol as a solvent is contained in an amount of at least 3% by weight. The thick film paste is excellent in printability, for example, has less viscosity change during printing and exhibits less bleeding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.