Surface treating process involving energy beam irradiation onto multilayered conductor parts of printed circuit board
US5601737A · kind A · utility
26Cited by
11References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 1994 |
| Grant date | Feb 11, 1997 |
| Priority date | — |
| Expiry date | Jun 29, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3489
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A surface treating process with respect to conductor parts on printed circuit board irradiates an energy beam onto the surface of the conductor parts each in a plurality of layers of different, single metal material, with the intensity, dosage and the like optimumly set and under such irradiating conditions that the respective metal material of the conductor parts do not form any mutual alloy, and the surface of the conductor parts on the printed circuit board can be thereby excellently treated as desired.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.