Patent · US Expired

Multilayer printed circuit boards and multichip-module substrates, with layers of amorphous hydrogenated carbon

US5601902A · kind A · utility

7Cited by

3References

2Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Albert Hammerschmidt · Erlangen, DE
Siegfried Birkle · Höchstadt an der Aisch, DE

Key dates

Filing date	May 17, 1995
Grant date	Feb 11, 1997
Priority date	—
Expiry date	May 17, 2015

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24917
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Multilayer printed circuit boards and multichip-module substrates having at least one layered composite of high-temperature-stable plastic and conductive tracks wherein the plastic is provided with a thin layer of amorphous, hydrogenated carbon (a--C:H) having a water permeation coefficient of <1.1.times.10.sup.-13 m.sup.2 /s. The a--C:H-layer also has a hardness gradient across it.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.