Chip carrier semiconductor device assembly
US5602419A · kind A · utility
19Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 1994 |
| Grant date | Feb 11, 1997 |
| Priority date | — |
| Expiry date | Dec 16, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01082
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip carrier semiconductor device comprises a semiconductor chip having a surface on which a plurality of contact pads, a tape carrier overlying the semiconductor chip and a plurality of leads provided on the tape carrier to overly the semiconductor chip, each of the leads having an inside end being provided with at last one bump for bonding a board, the bump being positioned on an inside area of the contact pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.