Stacked high mounting density semiconductor devices
US5602420A · kind A · utility
43Cited by
5References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 1995 |
| Grant date | Feb 11, 1997 |
| Priority date | — |
| Expiry date | Apr 27, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is provided with a stack of a plurality of semiconductor elements each having a bump deposited on each of surface electrodes, and a plurality of leads disposed closely adjacent to the stacked semiconductor elements, the leads being bonded to the bumps respectively thereby structurally integrally assembling the plural semiconductor elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.