Lapping process for minimizing shorts and element recession at magnetic head air bearing surface
US5603156A · kind A · utility
32Cited by
12References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 1994 |
| Grant date | Feb 18, 1997 |
| Priority date | — |
| Expiry date | Dec 16, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49048
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of lapping the air bearing surface of a magnetoresistive head which minimizes the likelihood of interelement shorts at the air bearing surface is described. In a final, linear lapping phase, the air bearing surface is lapped back and forth parallel to the longitudinal axis of the head elements in an oscillatory path across a stationary lapping surface. Any scratches or smears of the elements will be along the length of the elements rather than transverse to the elements. Any transverse scratches or smears occurring in earlier lapping phases will be removed during the linear lapping phase.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.