Electrically conductive adhesives
US5604026A · kind A · utility
17Cited by
7References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 5, 1995 |
| Grant date | Feb 18, 1997 |
| Priority date | — |
| Expiry date | Jun 5, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2848
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrically conductive adhesive is described that is made of a porous substrate having numerous passages extending through it. The walls of the substrate defining the passages are plated with a conductive metal. This provides a continuous plating from one side of the porous substrate to the other. The remaining passage volume is substantially filled with an adhesive resin. The adhesive can be used to electrically connect two metal surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.