Diamond/carbon/carbon composite useful as an integral dielectric heat sink
US5604037A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 1994 |
| Grant date | Feb 18, 1997 |
| Priority date | — |
| Expiry date | Nov 1, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A diamond/carbon/carbon composite is provided comprising a carbon/carbon composite having a polycrystalline diamond film deposited thereon. The carbon/carbon composite comprises a preform of interwoven carbon fibers comprising vapor grown carbon fibers. The preferred method of producing the composite involves chemical vapor infiltration of the pyrolytic carbon into the interstices of the preform, followed by microwave plasma enhanced chemical vapor deposition of the diamond film on the carbon/carbon composite. The resulting diamond/carbon/carbon composite is useful as an integral dielectric heat sink for electronic systems in spacecraft, aircraft and supercomputers due to its thermal management properties. Such a heat sink can be made by depositing metallic circuits on the diamond layer of the diamond/carbon/carbon composite.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.