Method of fabricating focal plane array

US5604977A · kind A · utility

Assignee

• TEXAS INSTRUMENTS INCORPORATED · US

Inventors

• James Robinson · Dallas, US
• James F. Belcher · Plano, US
• Howard R. Beratan · Richardson, US
• Steven N. Frank · McKinney, US
• Charles M. Hanson · Richardson, US
• Paul Oakley Johnson · Corning, US
• Robert J. S. Kyle · Battle Creek, US
• Edward G. Meissner · Allen, US
• Robert A. Owen · Faringdon, GB
• Gail D. Shelton · Mesquite, US
• William K. Walker · Plano, US

Key dates

• Filing date: Jun 7, 1995
• Grant date: Feb 25, 1997
• Expiry date: Jun 7, 2015

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49144
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A thermal detection system (10) includes a focal plane array (12), a thermal isolation structure (14), and an integrated circuit substrate (16). Focal plane array (12) includes thermal sensors (28), each having an associated thermal sensitive element (30). Thermal sensitive element (30) is coupled with one side to infrared absorber and common electrode assembly (36) and on the opposite side to an associated contact pad (20) disposed on the integrated circuit substrate (16). Reticulation kerfs (52a, 52b) separate adjacent thermal sensitive elements (30a, 30b, 30c) by a distance at least half the average width (44, 46) of a single thermal sensitive element (30a, 30b, 30c). A continuous, non-reticulated optical coating (38) may be disposed over thermal sensitive elements (30a, 30b, 30c) to maximize absorption of thermal radiation incident to focal plane array (12).