Device for sputtering a metallic material on a plate
US5605608A · kind A · utility
2Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1995 |
| Grant date | Feb 25, 1997 |
| Priority date | — |
| Expiry date | Jun 16, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2329/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A device for sputtering a metallic material on a plate comprises a vacuum chamber provided with a linear conveyor carrying at least one plate, the plate surface to be processed being turned downward. At least two sputtering sources are disposed under the conveyor, perpendicularly to its moving direction. Each source is associated with a collimator. The sputtering sources and their associated collimators are disposed to coat the whole width of the plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.