Method and apparatus for plating metals
US5605615A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 1994 |
| Grant date | Feb 25, 1997 |
| Priority date | — |
| Expiry date | Dec 5, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S204/09
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus for plating metals which delivers a voltage pulse with the possibility of a widely varying current magnitude characteristic to a plating electrode and an object having a large electrical reactance in terms of a parallel resistance and capacitance in order to raise the voltage potential between the electrode and an object to a programmed plating voltage overpotential and underpotential. The programmed plating voltage overpotential determines how fast the electrochemical reaction is allowed to proceed in the diffusion layer, and the programmed voltage underpotential determines how quickly the electrochemical reaction of the diffusion layer will slow down.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.