Patent · US Expired

Pattern transfer techniques for fabrication of lenslet arrays for solid state imagers

US5605783A · kind A · utility

86Cited by
3References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 6, 1995
Grant dateFeb 25, 1997
Priority date
Expiry dateJan 6, 2015

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG02B2006/12176
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

A method for forming lenslets which collect light and focuses it onto photosensitive elements of an electronic imager includes providing a transparent lenslet-forming layer on a substrate or on layers on the substrate and forming a thin etch-stop layer on the transparent lenslet-forming layer and patterning the etch-stop layer so that the mask pattern corresponds to lenslets to be formed, The method further includes anisotropically plasma etching the transparent lenslet-forming layer according to the thin etch-stop mask pattern, removing the thin etch-stop mask, and thermally reflowing the patterned transparent layer to form the transparent lenslets.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.