Heat-resistant adhesive for use especially in making sterilizable packaging
US5605944A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 27, 1995 |
| Grant date | Feb 25, 1997 |
| Priority date | — |
| Expiry date | Apr 27, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J177/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Polyamide/epoxy, thermoplastic-thermoset curable adhesive resin systems which are aqueous dispersions are disclosed; wherein the epoxy resin component has unreacted epoxy groups numbering, on average, between about 2 and about 8; the polyamide component comprises both an acid terminated polyamide resin having an acid number, on average, of from about 10 to about 30, in an amount of from about 20% to about 60% by weight of the total weight of polyamide resin, and an amine terminated polyamide resin having an amine number, on average, of from about 5 to about 30, in an amount of from about 80% to about 40% by weight of the total weight of polyamide resin; and additionally a neutralizing base in amount sufficient to neutralize from about 50% to about 80%, on an equivalents basis, of the total number of free acid groups occurring on the acid and amine terminated polyamide resin components; and optionally at least one water soluble, dipolar chemical moiety in an amount effective to provide stability in the overall resin composition; and optionally a surfactant. The disclosed adhesive resin systems exhibit stability to separation, premature curing or significant reaction at room temperat…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.