Polyamide compounds containing diepoxide and having high viscosity
US5605945A · kind A · utility
8Cited by
5References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 22, 1995 |
| Grant date | Feb 25, 1997 |
| Priority date | — |
| Expiry date | May 22, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to polyamide molding compounds with increased viscosity, high thermal stability and favorable mechanical properties, to a process for their production and to their use.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.