Patent · US Expired

Polyamide compounds containing diepoxide and having high viscosity

US5605945A · kind A · utility

8Cited by
5References
2Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 22, 1995
Grant dateFeb 25, 1997
Priority date
Expiry dateMay 22, 2015

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L63/00
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

The invention relates to polyamide molding compounds with increased viscosity, high thermal stability and favorable mechanical properties, to a process for their production and to their use.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.