High-frequency, high-density semiconductor chip package with screening bonding wires
US5606196A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 1995 |
| Grant date | Feb 25, 1997 |
| Priority date | — |
| Expiry date | Dec 29, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device package including a semiconductor chip formed with a plurality of bonding pads including at least two multiple-bonding pads to which identical signals are transmitted; a substrate provided with a chip-support and a plurality of conductors for electrically connecting the chip to external devices; a plurality of bonding wires for electrically connecting said bonding pads to the conductors including multiple-bonding wires for electrically connecting the multiple-bonding pads to corresponding conductors; and a current looper for screening magnetic fields generated from the bonding wires so that the magnetic fields cannot interfere each other, the current looper being located between the multiple-bonding wires and bonded to the substrate at both ends.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.