Component-mounted circuit board production system
US5607097A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1994 |
| Grant date | Mar 4, 1997 |
| Priority date | — |
| Expiry date | Jun 16, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K31/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A production system for mounting components on circuit boards includes a solder printing unit having a solder printing device for printing solder onto lands of a circuit board and a solder printing inspecting device for inspecting a printing state the solder, a component mounting unit having a component mounting device for mounting a component to a predetermined position of the printed solder on the circuit board and a component mounting inspecting device for inspecting a mounting state of the component, and a soldering unit having a soldering device for melting and hardening the printed solder and a soldering inspecting device for inspecting a soldering state of the soldering. The system further includes a data memory, a first information data input device for inputting into the data memory first data related to each of the devices in the printing unit, component mounting unit, and soldering unit, and a second information data input device for inputting into the data memory second data related results of countermeasures executed based on the inputted first data of the three inspecting devices. The system still further includes a correlation analyzing part which combines correspond…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.