Surface mounted holes for printed circuit boards
US5607313A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 27, 1995 |
| Grant date | Mar 4, 1997 |
| Priority date | — |
| Expiry date | Feb 27, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and device for improved assembly to hole-free PCBs of high aspect ratio components or any other components that are not easily assembled to a hole-free PCB by standard surface-mount technology (SMT), such as pins, lugs, tabs, and test points. A metal or other electrically conductive member having one or more holes ("holed component") is mounted to the PCB, typically on a solder pad on the PCB. The said electrically conductive member, will have a low aspect ratio. The hole, which may be round, rectangular, or threaded, is sized to provide an interference fit with the male projection of the component which will be inserted within the hole. The holed component, like other low aspect ratio SMT components, may be delivered on tape and reel and conventional surface mount or pick and place equipment is used to surface mount the holed component on the hole-free PCB, following which the holed component is soldered in place. Then, the male projections of the components can be press-fitted into the holes of one or more of such soldered holed components in the same manner as such components were previously interference fitted into the holes of PCBs, using high speed inserter machines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.