Process and apparatus for soldering electronic components to printed circuit board, and assembly of electronic components and printed circuit board obtained by way of soldering
US5607609A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 1994 |
| Grant date | Mar 4, 1997 |
| Priority date | — |
| Expiry date | Oct 24, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49083
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In accordance with the present invention, there is provided a soldering process comprising the steps of: providing in a furnace first and second heaters each adapted to emit infrared energy; setting a printed circuit board, which has a solder paste and an electronic component thereon, in the furnace; heating the printed circuit board with the first heater; and heating the electronic component with the second heater; wherein the first and second heaters have different radiation spectra such that infrared energy irradiated by the first heater is more absorbed by the printed circuit board and less absorbed by the electronic component than that irradiated by the second heater. The present invention also provides a soldering apparatus for use in such soldering process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.