Manufacturing circuit boards using a pick and place machine
US5609292A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 24, 1995 |
| Grant date | Mar 11, 1997 |
| Priority date | — |
| Expiry date | May 24, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S206/821
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Rectangular preforms are vacuum picked and placed in each cavity of a first holder, and a measured amount of no-clean flux liquid is dispensed onto each preform, then a second holder is placed in an inverted position (upside-down) on top of the first holder and the holders are flipped so that the dry side of the preform is exposed and then a measured amount of no-clean solder is dispensed on the dry side of the preform. The holders are unstacked and positioned on different sized posts extending upward from a pick-and-place machine. A robot arm with a rubber tipped vacuum probe picks up the preforms without damage or contamination and places them on a circuit board, grippers of the robot arm pick up and position a component on an induction coil to heat it up sufficient for reflow soldering, and then move the component onto the preform on the circuit board for reflow soldering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.