Patent · US Expired

Process and device for preparing a molding

US5609816A · kind A · utility

3Cited by
3References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 29, 1996
Grant dateMar 11, 1997
Priority date
Expiry dateApr 29, 2016

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB29L2031/3005
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

In a process for preparing a molding from fibers and/or flakes and thermoplastic binder, the material is introduced into a mold, compacted, and bonded by thermal effect. To make it possible to introduce the material rapidly and such that a consistently equal density or a density changing in a defined pattern will be obtained, a filling contour calculated for the given molding is formed by a first mold disk set. After filling the filling contour, a first finished contour mold is positioned against it. A second mold disk set, whose disks are displaceable between the disks of the first mold disk set and form the second finished contour of the molding, is subsequently displaced in the first mold disk set against the first finished contour mold, while the material present in the filling contour is compacted. The material is subsequently fixed by thermal effect.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.