Process and device for preparing a molding
US5609816A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 1996 |
| Grant date | Mar 11, 1997 |
| Priority date | — |
| Expiry date | Apr 29, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3005
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
In a process for preparing a molding from fibers and/or flakes and thermoplastic binder, the material is introduced into a mold, compacted, and bonded by thermal effect. To make it possible to introduce the material rapidly and such that a consistently equal density or a density changing in a defined pattern will be obtained, a filling contour calculated for the given molding is formed by a first mold disk set. After filling the filling contour, a first finished contour mold is positioned against it. A second mold disk set, whose disks are displaceable between the disks of the first mold disk set and form the second finished contour of the molding, is subsequently displaced in the first mold disk set against the first finished contour mold, while the material present in the filling contour is compacted. The material is subsequently fixed by thermal effect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.