Photoimageable composition having improved alkaline process resistance and tack-free surface for contact imaging
US5609991A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 1995 |
| Grant date | Mar 11, 1997 |
| Priority date | — |
| Expiry date | Aug 3, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F2810/30
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A photoimageable composition, useful as a photoresist for forming a printed circuit board, is both alkaline aqueous developable but, subsequent to exposure and development, is processable in highly alkaline environments, such as additive plating baths and ammoniacal etchants. The photoimageable composition is tack-free and is resistance to polymerization inhibition by oxygen, and is therefore particularly suitable for contact printing. The photoimageable composition comprises A) between about 25 and about 75 wt % of a binder polymer, B) between about 20 and about 60 wt % of a photopolymerizeable material which is a multifunctional photopolymerizeable monomer or short chain oligomer, and C) between about 2 and about 20 wt % of a photoimageable chemical system, the weight percentages being based on the total weight of components A)-C). The improvement is the use in the photoimageable composition of a binder polymer A) which is a styrene/maleic anhydride copolymer in which the incorporated maleic anhydride units are mono-esterified to between about 50 and about 65 mole percent of an alkyl, aryl, cycloalkyl, alkaryl, or arylalkyl alcohol having a molecular weight greater than 100, to b…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.