Resin compound for molding precision parts, and sleeve and ferrule produced therefrom
US5610219A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 1995 |
| Grant date | Mar 11, 1997 |
| Priority date | — |
| Expiry date | Nov 6, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/3874
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A resin compound for molding precision parts containing 20 to 40% by weight of at least one of polyphenylene sulfide and aromatic polyester thermotropic liquid crystalline polymer, 15 to 25% by weight of whisker and 40 to 60% by weight of spherical fine particles, wherein the total content of the whisker and the spherical fine particles is 60 to 80% by weight, and a resin compound for molding precision parts containing 20 to 40% by weight of at least one of polyphenylene sulfide and aromatic polyester thermotropic liquid crystalline polymer, 5 to 25% by weight of whisker, 40 to 75% by weight of spherical fine particles and 0.5 to 3% by weight of silane coupling agent, wherein the total content of the whisker and the spherical fine particles is 60 to 80% by weight are disclosed. Mechanical strength of the resin compounds can be increased without the impairment of dimensional precision, surface smoothness and low coefficient of thermal expansion. The resin compounds can be suitably used for molding precision parts, for instance, sleeve, ferrule and the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.