Impact modified polyamide-based molding composition
US5610223A · kind A · utility
4Cited by
8References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 13, 1995 |
| Grant date | Mar 11, 1997 |
| Priority date | — |
| Expiry date | Jul 13, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L83/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The impact strength of a thermoplastic molding composition containing polyamide resin is improved upon the incorporation therewith of a particular silicone rubber powder. The silicone rubber powder, added at a level of about 1 to 25 percent contains a mixture of (a) a polydiorganosiloxane and (b) finely divided silica filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.