Substrate system for optoelectronic/microwave circuits
US5611008A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 26, 1996 |
| Grant date | Mar 11, 1997 |
| Priority date | — |
| Expiry date | Jan 26, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4232
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A low-loss substrate system is provided for carrying and interconnecting optoelectronic/microwave circuits. The system includes a high-resistivity substrate, e.g., silicon of resistivity >1.times.10.sup.3 ohm-centimeter. A dielectric layer, e.g., silicon dioxide, is preferably deposited over at least a portion of the substrate. Low-loss microwave transmission members and passive microwave components, e.g., capacitors and spiral inductors, can be fabricated directly on the dielectric layer with thin-film techniques. Optoelectronic and microwave integrated circuits are preferably mounted on the substrate system with solder bumps and bonding pads. Other portions of the substrate can define grooves for receiving optical fibers. To enhance optical alignment, the grooves and bonding pads are preferably located with photolithographic techniques. The substrate system is especially suited for optoelectronic/microwave circuits that are realized with hybrid integration structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.