Soldering process
US5611480A · kind A · utility
6Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 3, 1994 |
| Grant date | Mar 18, 1997 |
| Priority date | — |
| Expiry date | Oct 3, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3468
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a soldering process leads of components on a circuit board are dipped into a solder bath to solder them to the underside of the board. The board is rotated about a horizontal axis as it is lifted away from the bath. This reduces the tendency to form solder bridges between closely spaced leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.