Connector module with molded upper section including molded socket, socket pins, and positioning elements
US5611697A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 1995 |
| Grant date | Mar 18, 1997 |
| Priority date | — |
| Expiry date | Aug 16, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/925
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An interface connector device having two assemblies for interconnecting a plurality of input/output devices to a multi-wire bus. The first assembly is electrically connected directly to the multi-wire bus and the second is carried on the first assembly and supports an IC chip. The second assembly includes electrical connections for connecting the input and output devices to the IC chip and for connecting the multi-wire bus to the IC chip for conveying the signals between the multi-wire bus and the input and output devices. The second assembly incorporates a single molded piece including a molded socket for receiving the IC chip, a set of molded pins adapted to receive conductive coatings for electrically connecting the input and output devices to the IC chip, and molded positioning elements for orienting the second assembly with respect to the first assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.