Flip chip silicone pressure sensitive conductive adhesive
US5611884A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 11, 1995 |
| Grant date | Mar 18, 1997 |
| Priority date | — |
| Expiry date | Dec 11, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method and composition for joining flip chips back-side-up with respect to substrates by applying an adhesive between the active side of the flip chip and the substrate. The adhesive is a conductive silicone pressure sensitive adhesive containing (i) a silicone resin, (ii) a siloxane gum, (iii) a conductive particulate material, and optionally, (iv) a peroxide catalyst. Suitable conductive particulate materials are silver-clad glass fibers; spherical gold particles; spherical hollow glass microspheres coated with silver, gold, nickel, or copper; or spherical particles of metal alloys of Sn/Cu, Pb/Sn, or Au/Sn. The adhesive can be applied as a ball or bump itself, in conjunction with a solder ball or bump, or in the form of tape sandwiched between the flip chip and substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.