Process chamber for semiconductor substrates
US5611886A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 1995 |
| Grant date | Mar 18, 1997 |
| Priority date | — |
| Expiry date | Sep 19, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/162
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process chamber configurable for the execution of discrete subprocesses in a substrate coating process such as photolithography. Two vertically staggered rings disposed within the process chamber channel a flow of gas through the chamber and retain fluent chemical within the process environment. A replaceable liner further enables reconfiguration of the chamber. The chamber is used for low-velocity dispensing of fluent process chemical onto the substrate surface with a laminar exhaust gas flow through ventilation passages formed about the rings. The chamber is also used during high-velocity spinning of the substrate for even process chemical distribution in a solvent saturated atmosphere. The ventilation passages enable high exhaust flow through the chamber while minimizing the direct impingement of exhaust air on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.