Electroplating process
US5611905A · kind A · utility
2Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 9, 1995 |
| Grant date | Mar 18, 1997 |
| Priority date | — |
| Expiry date | Jun 9, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/427
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for electroplating a substrate by coating the substrate with a coating of conductive particles. The coating of conductive particles is applied to the substrate from an aqueous dispersion containing a dissolution agent for metallic regions of the substrate. The dissolution agent removes the top surface of the metal as the conductive particle coating is formed thereby facilitating removal of the same from the metallic regions of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.