Aqueous, modified epoxy resin dispersions

US5612394A · kind A · utility

Assignee

• Hoechst GmbH · DE

Inventors

• Armin Pfeil · Kaufering, DE
• Michael Hoenel · Wiesbaden, DE
• Paul Oberressl · Wiesbaden, DE
• Dieter Dreischhoff · Wiesbaden, DE
• Stefan Petri · Taunusstein, DE

Key dates

• Filing date: Jun 2, 1994
• Grant date: Mar 18, 1997
• Expiry date: Jun 2, 2014

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L71/02
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Aqueous epoxy resin dispersion comprising (A) an epoxy resin which is a condensation product of (A-1) from 50 to 95% by weight, preferably from 55 to 85% by weight, of one or more epoxide compounds having at least two epoxide groups per molecule and an epoxide equivalent mass of from 100 to 2000 g/mol, (A-2) from 5 to 50% by weight, preferably from 15 to 45% by weight, of an aromatic polyol; and (A-3) from 0 to 25% by weight, preferably from 0 to 10% by weight, of modifying compounds containing at least two epoxide-reactive groups; (B) a dispersant comprising (B-1) a condensation product of a polyol having a weight-average molecular mass (M.sub.w) of from 200 to 20,000 g/mol and an epoxide compound having on average at least two epoxide groups per molecule and an epoxide equivalent mass of from 100 to 10,000 g/mol, and (B-2) if desired other surfactants, preferably nonionic surfactants; (C) a polymer, prepared in this dispersion, of ethylenically unsaturated monomers which are capable of free-radical polymerization or copolymerization; (D) a curing agent for the epoxy resin (A); and (E) if desired, conventional additives and catalysts. These aqueous epoxy resin dispersions are suit…