Curable adhesive compositions containing polyamide resins
US5612448A · kind A · utility
11Cited by
16References
30Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 21, 1995 |
| Grant date | Mar 18, 1997 |
| Priority date | — |
| Expiry date | Apr 21, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J177/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Hot melt adhesive compositions containing amine and acid terminated polyamide resins, optionally curable when combined with epoxy resins, wherein the amine component of the polyamide resin contains (i) 1,2-diaminopropane, (ii) a piperazine-containing diamine, and optionally, (iii) polyetherdiamines; the polyamide resins may be acid or amine terminated, and are characterized by having an acid plus amine number of up to 40, preferably up to 30, and more preferably up to 20; the adhesive compositions are useful in a number of applications and have good strength while exhibiting flexibility and low tackiness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.