Integrated electro-optical package
US5612549A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 1994 |
| Grant date | Mar 18, 1997 |
| Priority date | — |
| Expiry date | Mar 24, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12044
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrated electro-optical package including an optically transparent substrate with a large array of light emitting devices formed thereon and cooperating to generate a complete real image. The light emitting devices are positioned in rows and columns and connected to pads adjacent outer edges of the substrate. A driver substrate having mounting pads, bump bonded to the pads on the substrate. A plurality of driver circuits connected to the light emitting devices through terminals on the driver substrate. A lens mounted to the substrate over the array of light emitting devices and on a side opposite to magnify the real image and produce an easily viewable virtual image.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.