Method of connecting the output pads on an integrated circuit chip, and multichip module thus obtained
US5612575A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 16, 1995 |
| Grant date | Mar 18, 1997 |
| Priority date | — |
| Expiry date | May 16, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The chip is fixed to a substrate by its lower face. At least one wire-bonding adaptor in the form of a board is used, the upper face of which has first bonding pads along at least one first edge and second bonding pads along at least one second edge, and including electrical connections between the first and second bonding pads. The wire-bonding adaptor is adhesively bonded by its lower face to the upper face of the chip so that the said first edge is adjacent to a row of output pads located elsewhere than on the periphery of the upper face of the chip and so that the said second edge is adjacent to the periphery of the chip. Bonding wires are bonded, on the one hand, between the output pads of the said row and the first bonding pads and, on the other hand, between the second bonding pads and conducting pads on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.