Force applying blade device exhibiting a reduced creep rate
US5613179A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 21, 1995 |
| Grant date | Mar 18, 1997 |
| Priority date | — |
| Expiry date | Nov 21, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03G2215/1609
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A spring force applying blade device for exhibiting a reduced creep rate when bent in a force applying application. The spring force applying device includes a guide member for supporting a blade member. The guide member has a curved portion for supporting a blade member bent thereover for applying a force. The spring force applying blade device also includes a spring blade member that has a first edge that is attached to the guide member, and a second and opposite edge for applying a force when bent over the curved portion of the guide member. The blade member is comprised of a plurality of blade layers for reducing stress and for reducing a creep rate of the blade member when bent over the curved portion of the guide member in a force applying application. The plurality of blade layers are attached together at the first edge of the blade member and are free to slide relative to each other at the second and opposite edge. The plurality of blade layers have different thicknesses and wherein a layer having the least thickness is closest to the guide member. Preferably, the spring force applying blade is used to assist transferring an image in a electrostatic reproduction machine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.