Electroless gold plating solution
US5614004A · kind A · utility
10Cited by
10References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 1995 |
| Grant date | Mar 25, 1997 |
| Priority date | — |
| Expiry date | Aug 14, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/44
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides an electroless gold plating solution which does not precipitate gold at high concentrations of thallium or lead compound, while retaining its effects such as increased deposition rate and larger crystallite sizes in the deposited layer. The electroless gold plating solution according to the invention contains 0.1-10 g/l of a chelating agent, such as diethylenetriaminetetraacetic acid (DTPA), ethylenediaminetetraacetic acid or nitrilotriacetic acid, DTPA being a preferable agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.