Method for fabricating electronic components incorporating ceramic-metal composites
US5614043A · kind A · utility
21Cited by
16References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1994 |
| Grant date | Mar 25, 1997 |
| Priority date | — |
| Expiry date | Mar 31, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24997
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The present invention relates to electronic components and in particular relates to ceramic-based electronic components wherein a portion of the component comprises a metal-infiltrated ceramic. In a preferred embodiment, the metal-infiltrated ceramic comprises copper metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.