Laser system and method for plating vias
US5614114A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 20, 1994 |
| Grant date | Mar 25, 1997 |
| Priority date | — |
| Expiry date | Oct 20, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/108
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The output of a continuously pumped, Q-switched, Nd:YAG laser (10) is frequency converted to provide ultraviolet light (62) for plating internal wall surfaces (79, 126) of vias (72, 74) in multilayered electronic devices (80). The parameters of the output pulses (62) are selected to facilitate substantially uniform deposition of plating material particles explosively vaporized from a substrate (124) onto the internal wall surface (79, 126). These parameters typically include at least two of the following criteria: high average power of greater than about 100 milliwatts measured over the beam spot area, a temporal pulse width shorter than about 100 nanoseconds, a spot diameter of less than about 50 microns, and a repetition rate of greater than about one kilohertz.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.