Method of producing a frame made of connected semiconductor die mounting substrates
US5614443A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 1996 |
| Grant date | Mar 25, 1997 |
| Priority date | — |
| Expiry date | Mar 27, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1057
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Method of producing a frame made of connected semiconductor die mounting substrates comprises i) a first step for producing a metal substrate sheet wherein an original material for metal substrate sheet of a desired size is cut out from a metal material and an erosion preventing layer is provided on the entire surface thereof, ii) a second step for producing a circuit substrate sheet wherein the circuit substrate sheet is made of a resin substrate coated with a copper leaf layer and is provided with a lead pattern on the surface thereof in place, iii) a third step for producing a connected semiconductor die mounting substrate sheet by adhering the metal substrate sheet to the circuit substrate sheet, iv) a fourth step for forming a plurality of pilot apertures and slits on the connected semiconductor die mounting substrate sheet by press working and v) a fifth step for producing a plurality of connected semiconductor die mounting substrate frames by separating the connected semiconductor die mounting substrate sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.