BGA semiconductor device including a plurality of semiconductor chips located on upper and lower surfaces of a first substrate
US5615089A · kind A · utility
67Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 24, 1995 |
| Grant date | Mar 25, 1997 |
| Priority date | — |
| Expiry date | Jul 24, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a first substrate carrying semiconductor chips on both upper and lower major surfaces thereof, a second substrate carrying the first substrate, and a resin package body having a first part for embedding the semiconductor chips on the upper major surface of the first substrate and a second part for embedding the semiconductor chips on the lower major surface of the first substrate, wherein the second substrate carries on a lower major surface thereof solder bumps forming a BGA structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.