Heat sink spring clamp
US5615735A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 1994 |
| Grant date | Apr 1, 1997 |
| Priority date | — |
| Expiry date | Sep 29, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved heat sink assembly apparatus and method of attachment that includes a heat sink with extruded fins, an integrated circuit package, a printed circuit board and a clamp. The printed circuit board is manufactured with L-shaped holes that correspond to opposing corners of the integrated circuit package and the distance between two notched feet on the clamp. To assemble, the integrated circuit package is mounted to the printed circuit board, the heat sink is mounted to a top surface of the integrated circuit package, the clamp is mounted between extruded fins on the heat sink, and then the feet of the clamp are locked into the L-shaped holes on the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.